Category:Semiconductors

C

• ► Charge carriers‎ (1 C, 20 P)
• ► Compound semiconductors‎ (7 P)

D

• ► Semiconductor device fabrication‎ (6 C, 92 P)
• ► Semiconductor devices‎ (5 C, 17 P)

M

• ► Semiconductor materials‎ (3 C, 66 P)

P

• ► Semiconductor physicists‎ (20 P)

S

• ► Semiconductor analysis‎ (23 P)
• ► Semiconductor companies‎ (4 C, 47 P)
• ► Semiconductor device defects‎ (11 P)
• ► Semiconductor device materials‎ (3 P)
• ► Semiconductor material structures‎ (1 C, 3 P)
• ► Semiconductor material types‎ (6 P)
• ► Semiconductor packages‎ (1 C, 12 P)
• ► Semiconductor structures‎ (21 P)

• Semiconductor

*

• Rubber diode

A

• Anomalous photovoltaic effect

C

• Carbon nanofoam

D

• Die shrink
• Diffusion capacitance

E

• Electron mobility
• Etch pit density

F

• Floating body effect

H

• Haynes–Shockley experiment
• Hot-carrier injection

I

• Impact ionization
• Isobutylgermane
• Isotropic etching

J

• Johnson's figure of merit

M

• Moisture sensitivity level

N

• Negative luminescence

O

• On-die termination

P

• Photo–Dember effect
• Photoelectrochemical process
• Proximity communication

R

• Reverse leakage current
• Roll-to-roll processing

S

• Semiconductor device
• Sheet resistance
• Solid-state electronics
• Strain engineering

T

• Thermal copper pillar bump
• Thin-film transistor
• Topological insulator
• Transistor channel
• Transmission line measurement
• Trimethylgallium
• Trimethylindium
• Tunnel injection