File:B-d-irphotobondwave.png

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Original file(1,107 × 360 pixels, file size: 222 KB, MIME type: image/png)
Description

Infrared photograph of initiation and propagation of bonding wave in wafer bonding of silicon wafers (in style of \cite{TG1998}). (l) wafers are separated by an air layer and the bond process starts by pressure on top wafer. (m) bond wave moves to the etches. (r) a perfectly bonded wafer pair, not reflecting IR light.

Source

Q.-Y. Tong and U. Gösele, Semiconductor Wafer Bonding: Science and Technology (1998)

Date

22:17, 29 March 2011 (UTC)

Author

Fraunhofer ENAS, D. Neumann

Permission
(Reusing this file)

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current10:31, 13 November 2022Thumbnail for version as of 10:31, 13 November 20221,107 × 360 (222 KB)Thales (talk | contribs)
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